Electronics and IT Minister Ashwini Vaishnaw along with Odisha Chief Minister Mohan Charan Majhi and CEO of Intel today witnessed the signing of an MoU to bring substrate manufacturing technology to India. Mr Vaishnaw said this will further advance semiconductor ecosystem in India. He stressed that signing of the landmark MoU is in line with the Government’s vision of developing the entire ecosystem of semiconductor manufacturing in India.
The MoU has been signed between the Government of Odisha, Intel Corporation and 3DGS Inc. USA for a framework to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in Odisha. The project represents one of the largest high-technology manufacturing investments in the country. The facility is proposed to be located in the Bhubaneswar-Khurda region.
The proposed project would be implemented in phases over a period of five-six years. It is expected to generate direct high-skilled employment opportunities while creating significant indirect employment across the broader manufacturing and technology ecosystem.
